LOCTITE ABLESTIK 816H01
Keywords：LOCTITE ABLESTIK 816H01,TRA-BOND SUPERTHERM 816H01,TRA-BOND 816H01, low volatile, high thermal conductivity,NASA low outgassing glue, is a two-component, room temperature curing, 2W/mK High thermal conductivity insulating epoxy adhesive
Description：LOCTITE ABLESTIK 816H01 (known as SUPERTHERM 816H01) is a two-component, room temperature curing, high thermal conductivity epoxy adhesive.
LOCTITE ABLESTIK 816H01 (known as SUPERTHERM 816H01) is a two-component, room temperature curing, high thermal conductivity epoxy adhesive. Can be used to fix transistors, diodes, resistors, integrated circuits, and other thermal sensitive components to printed circuit boards for thermal bonding. This adhesive forms a strong, durable, and high impact resistant bonding layer at room temperature, improving heat transfer while maintaining electrical isolation. LOCTITE ABLESPIK 816H01 is resistant to corrosion from salt solutions, weak acids and bases, petroleum solvents, lubricants, and other chemicals, meeting NASA outsourcing requirements.
Electrical insulation
heat conduction: 2.0 W/m-K
Thixotropy
| Technical information | |
| colour | white |
| viscosity | five thousand |
| Curing method | 24 hours @ 25°C |
| hardness | ShoreD 80 |
| Shear strength, aluminum aluminum | 1700psi |
| Temperature resistance range | -70 to 115oC |
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