LOCTITE ABLESTIK 84-1LMISR4
LOCTITE ABLESTIK 84-1LMISR4 (known as Ablebund 84-1LMISR4) conductive chip bonding adhesive is specially developed for high-yield, automated chip bonding equipment. The rheological properties of LOCTITE ABLESPIK 84-1LMISR4 adhesive minimize the dispensing and mounting time of the adhesive without causing tailing or drawing problems. The unique combination of adhesive properties makes this material one of the most widely used chip bonding materials in the semiconductor industry.
electric conduction
Box oven curing
Excellent adhesive properties, minimizing trailing and drawing phenomena
| Technical information | |
| CTE Below Tg | 40 ppm/°C |
| CTE, Above Tg | 150ppm/°C |
| Main characteristics | Conductivity: Thermal conductivity, Conductivity: Conductive, Easy to apply Adhesive properties: Excellent, Easy to apply Adhesive properties: Good, Filler: Silver, Strength: High strength, no freezing when placed in low temperature environments, Usability: Easy to use, Modulus: High, Glue dispensing, Thermal stability: Excellent thermal stability, Production efficiency: Ultra high, Adhesive strength: Extremely strong |
| Volume resistivity | ≤ 0.0002 Ohm cm |
| Extractable ion content, chloride (CI -) | 20 ppm |
| Extractable ion content, sodium (Na+) | 10 ppm |
| Extractable ion content, potassium (K+) | 10 ppm |
| Hygroscopicity, 168 hr. @ 85°C/85% RH | 0.6 % |
| Curing method | heating |
| Curing time@ 175.0 °C | 1 hour |
| base material | Lead frame: gold, lead frame: silver |
| Appearance and Form | Paste like substance |
| Thermal conductivity | 2.5 W/mK |
| application | Chip soldering |
| Application method | Dosing device |
| Tensile modulus@ 250 °C | 300 N/mm2 (44000 psi ) |
| Glass transition temperature (Tg) | 120 °C |
| Viscosity, Bolefi CP51@ 25 °C Speed 5 rpm | 8000 mPa.s (cP) |
| Number of components | Single component |
| Thixotropic index | five point six |
| colour | silver |
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