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At present, the assembly of electronic components continues to develop in the direction of miniaturization, miniaturized encapsulation components are not only smaller specifications, but also highly integrated functions, and power devices generate more heat to electronic device products and equipment integrated thermal conductivity solutions have brought more and more challenges. Appropriate thermal management design and selection of thermal conductivity materials are issues that every product design engineer must consider.

We can provide various forms of thermal interface materials, such as silicone thermal gel, silicone thermal gasket, thermal insulation gasket, thermal grease, non-silicon thermal Putty, non-silicon thermal gasket, thermal phase change material, thermal potting glue, thermal structure adhesive and so on. Different types of thermal conductivity materials can meet a variety of thermal conductivity structure design, increase the heat dissipation performance of devices and equipment, and extend the service life.